Description
Toughened Structural 1:1 Ratio Adhesive which requires minimal surface preparation. Designed to be load bearing and resistant to a wide variety of environmental conditions. Formulated to bond dissimilar substrates, ceramics and engineered plastics. This material replaces : Devcon-DA295
Features:
- Color Black
- Non-Sag Gel
- UV resistant
- Chemical resistant to acids, solvents, hydrocarbons and salt solutions
- Ability to bond a wide range of materials
- High strength
Characteristics:
- Working Time 3-6 minutes
- Fixture Time 12-15 minutes
- Operating Temperatures -67°F-250°F (-55°C-121°C)
- Gap Filling 0.012in -0.125in (0.30mm-3.2mm
- Mixed Density 8.10lbs/Gal (0.97g/cc)
- Flash Point 51°F (11°C)
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